Wafer-lifting device.



PATENTED APR. 2, 1907.

v Y.,KAWASIA'KI.I WAFER LIFTING DEVICE.

APPLICATION PILED NOV. 3 0, 1906 'I/V VEIVTOH Yaauiw ffozwwscdiWITNESSES:

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YASUKE KAWASAKI, OF VANCOUVER, BRITISH COLUMBIA, CANADA.

WAFER-LIFTING DEVICE.

Specification of Letters Patent.

Patented April 2, 1907.

Application filed November 30, 1906. Serial No. 345,780.

To all whmn it may concern.-

Be it known that I, YAsUKE KAWASAKI, a

citizen of the Japanese Empire, residing at the city of Vancouver, inthe Province of British Columbia, Canada, have invented a new and usefulImprovement in Wafer-Lifting Devices, of which the following is aspeciflcation. i

This invention relates to a device for de,- taching and removing fromthe plate on which they are baked thin flat waferbis cuits of that kindknown by the Japanese as senbe. These biscuits, a number of which areformed and baked at one time by pouring a fluid batter between twoheated plates in a device which is the subject of a pending patentapplication, adhere strongly to the lower plate, owing to the presenceof a considerable amount of sugar in the compo- .sition of the batterand to the fact that the batter is poured upon the lower plate whilehot. As the wafers require to be removed from the plate as soonas bakedand while in that condition are readily bent, while when cool theybecome very brittle, it is necessary that whatever means is used to liftthem from the plate should be such as will deliver them flat. Otherwisethey will become broken in the packing. The most effective means which Ihave been able to devise to effect this lifting and removal comprises aseries of thin flat resilient blades, the lower sharpened edges of whichmay be'passed under the wafer and the form of which is such that thewafer will lie flat on the surface of the blade and recover while hotthe flatness which may have been somewhat disturbed in the act oflifting. This series of plates corresponds in number to the number ofwafers to be lifted and is secured to a common frame by which they maybe manipulated.

The construction and manner of using the device is fully described inthe following specification, reference being made to the drawings bywhich it is accompanied, Figure 1 being a vertical section through thedevice on the line A A in Fig. 3 Fig. 2, a vertical section on the lineB B in Fig. 3, and Fig. 3 a plan of the device with a portion of theframe broken away to reveal the front of the liftingblades.

In the drawings the upper surface of the baking-plate is represented by2, and 3 indicates the wafers which the appliance is designed to liftfrom the plate and transfer to some other place to cool.

The lifting-blades are formed of thin resilient metal and have aflattened portion 4 inclined at an acute angle to the plane of thebaking-plate and a sharpened lower edge where it contacts with thatplate. Above the flat portion 4 it is upwardly and forwardly bent, as at5, to afford a sufficient amount of resilience and is thereafter bentbackward, as at 6, to a plane parallel with the baking-plate 2 and is bythis portion 6 attached to the under side of a plate or preferably tothe bars 10 of an open frame 11. By the use of an open frame the edgesof the several blades can be viewed by the operator during theirapplication to the wafers.

The frame 11 is furnished with wooden handles 7, by which it ismanipulated by the operator.

The several lifting-blades may either be separately connected to theplate or frame by strips 8 and small bolts or screws 9, or each row ofblades may be formed from one strip of thin metal and cut to formdenticulations in the manner shown in the drawings. It is necessary thateach blade should be sep arated from the adjacent ones inthe same row;otherwise the expansion of the lower edge where it contacts with the hotplate would distort that edge in a manner that would prevent it beinginserted under the wafers.

In the application of the device to lift and remove a series of wafersfrom a baking-plate the device is seized by the handles 7 and the lowersharpened edges of the blades are inserted under the edges of thewafers. The device is then pushed forward with a quick movement, whichtransfers the wafers from .the plate 2, and they are pushed up theincline of the blade and rest, as shown in Fig. 1, upon the flat portion4 thereof, on the surface of which, if they have been slightly bent inthe act of lifting, they will flatten of their own weight while stillwarm.

Having now particularly described my invention and the manner of itsuse, I hereby declare that what I claim as new, and desire to beprotected in by Letters Patent, is

1. As a wafer-lifting device a series of independently resilient thinblades downwardly projecting at an acute incline from a common frame towhich they are secured.

2. As a wafer-lifting device a series of independently resilientinclined blades and means for securing them to a common frame or plate.

3. As a wafer-lifting device an open frame F In testimony whereof I havesigned my having handles on the sides and a series of inname to thisspecification in the presence of 1 depenclfntlyaresilientfthinbladeilsracurgd to two subscribing Witnesses. the un er si e of the ramesaid a es e'mg 5 first backwardly bent and then forwardly YASUKEKAWASAKI' bent to form a fiat surface at an acute angle Witnesses: to acommon plane through the front lower ROWLAND BRITTAIN, edges of theblades. CLIVE S. OARMAN.

